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Monolithic Integration of Si-CMOS and III-V-on-Si Through Direct Wafer Bonding Process

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Integration of silicon-complementary metal oxide-semiconductor (Si-CMOS) and III-V compound semiconductors (with device structures of either InGaAs HEMT. AlGaInP LED. GaN HEMT. or InGaN LED) on a common Si substrate is demonstrated. https://www.shoptracepaper.com/product-category/boxes/
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